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1

From design for manufacturing (DFM) to manufacturing for design (MFD) via hybrid manufacturing and smart factory: A review and perspective of paradigm shift

Chu, Won-Shik, Kim, Min-Soo, Jang, Ki-Hwan, Song, Ji-Hyeon, Rodrigue, Hugo, Chun, Doo-Man, Cho, Young Tae, Ko, Seung Hwan, Cho, Kyu-Jin, Cha, Suk Won, Min, Sangkee, Jeong, Sung Ho, Jeong, Haedo, Lee,

Journal:

International Journal of Precision Engineering and Manufacturing-Green Technology

Year:

2016

Language:

english

File:

PDF, 1.12 MB

english, 2016

2

Microreplication techniques using soft lithography

Sungil Chung, Yonggwan Im, Jaeyoung Choi, Haedo Jeong

Journal:

Microelectronic Engineering

Year:

2004

Language:

english

File:

PDF, 1.06 MB

english, 2004

3

Slurry components in metal chemical mechanical planarization (CMP) process: A review

Lee, Dasol, Lee, Hyunseop, Jeong, Haedo

Journal:

International Journal of Precision Engineering and Manufacturing

Year:

2016

Language:

english

File:

PDF, 776 KB

english, 2016

4

Temperature distribution in polishing pad during CMP process: Effect of retaining ring

Hyunseop Lee, Yongchang Guo, Haedo Jeong

Journal:

International Journal of Precision Engineering and Manufacturing

Year:

2012

Language:

english

File:

PDF, 1.52 MB

english, 2012

5

A wafer-scale material removal rate profile model for copper chemical mechanical planarization

Hyunseop Lee, Haedo Jeong

Journal:

International Journal of Machine Tools and Manufacture

Year:

2011

Language:

english

File:

PDF, 1.61 MB

english, 2011

6

Effect of pad groove geometry on material removal characteristics in chemical mechanical polishing

Yongchang Guo, Hyunseop Lee, Youngkyun Lee, Haedo Jeong

Journal:

International Journal of Precision Engineering and Manufacturing

Year:

2012

Language:

english

File:

PDF, 10.21 MB

english, 2012

7

Characterization of diamond wire-cutting performance for lifetime estimation and process optimization

Kim, Doyeon, Kim, Hyoungjae, Lee, Sangjik, Lee, Taekyung, Jeong, Haedo

Journal:

Journal of Mechanical Science and Technology

Year:

2016

Language:

english

File:

PDF, 863 KB

english, 2016

8

Evaluation of micro-replication technology using silicone rubber molds and its applications

Sungil Chung, Yonggwan Im, Hoyoun Kim, Haedo Jeong, David A Dornfeld

Journal:

International Journal of Machine Tools and Manufacture

Year:

2003

Language:

english

File:

PDF, 1008 KB

english, 2003

9

Pad roughness variation and its effect on material removal profile in ceria-based CMP slurry

Boumyoung Park, Hyunseop Lee, Kihyun Park, Hyoungjae Kim, Haedo Jeong

Journal:

Journal of Materials Processing Technology

Year:

2008

Language:

english

File:

PDF, 989 KB

english, 2008

10

Influence of slurry components on uniformity in copper chemical mechanical planarization

Hyunseop Lee, Boumyoung Park, Haedo Jeong

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 841 KB

english, 2008

11

Effect of mechanical factor in uniformity for electrochemical mechanical planarization

Sukhoon Jeong, Jaehyun Bae, Hyunseop Lee, Hojun Lee, Youngkyun Lee, Boumyoung Park, Hyoungjae Kim, Sungryul Kim, Haedo Jeong

Journal:

Sensors and Actuators A: Physical

Year:

2010

Language:

english

File:

PDF, 1.42 MB

english, 2010

12

Effect of process conditions on uniformity of velocity and wear distance of pad and wafer during chemical mechanical planarization

Hyoungjae Kim, Haedo Jeong

Journal:

Journal of Electronic Materials

Year:

2004

Language:

english

File:

PDF, 687 KB

english, 2004

13

Chemical mechanical planarization of copper bumps on printed circuit board

MoonKi Jeong, SeungJae Jo, HyunSeop Lee, AhReum Lee, ChungYun Kang, JinWon Choi, JinHo Kim, HaeDo Jeong

Journal:

International Journal of Precision Engineering and Manufacturing

Year:

2011

Language:

english

File:

PDF, 272 KB

english, 2011

14

A study on microreplication of real 3D-shape structures using elastomeric mold: from pure epoxy to composite based on epoxy

Sungil Chung, Sunjoon Park, Inwhan Lee, Haedo Jeong, Dongwoo Cho

Journal:

International Journal of Machine Tools and Manufacture

Year:

2004

Language:

english

File:

PDF, 1.51 MB

english, 2004

15

Investigation of polishing characteristics of shallow trench isolation chemical mechanical planarization with different types of slurries

Sang-Ick Lee, Jinho Hwang, Hyoungjae Kim, Haedo Jeong

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 773 KB

english, 2007

16

Structural effect of PVA brush nodule on particle removal efficiency during brush scrubber cleaning

Joonho An, Yeongbong Park, Haedo Jeong

Journal:

International Journal of Precision Engineering and Manufacturing

Year:

2012

Language:

english

File:

PDF, 3.42 MB

english, 2012

17

Evaluation of environmental impacts during chemical mechanical polishing (CMP) for sustainable manufacturing

Hyunseop Lee, Sunjoon Park, Haedo Jeong

Journal:

Journal of Mechanical Science and Technology

Year:

2013

Language:

english

File:

PDF, 1.43 MB

english, 2013

18

Multi-wire sawing of sapphire crystals with reciprocating motion of electroplated diamond wires

Kim, Hyoungjae, Kim, Doyeon, Kim, Chulmin, Jeong, Haedo

Journal:

CIRP Annals - Manufacturing Technology

Year:

2013

Language:

english

File:

PDF, 810 KB

english, 2013

19

Effect of initial deflection of diamond wire on thickness variation of sapphire wafer in multi-wire saw

Kim, Doyeon, Kim, Hyoungjae, Lee, Sangjik, Jeong, Haedo

Journal:

International Journal of Precision Engineering and Manufacturing-Green Technology

Year:

2015

Language:

english

File:

PDF, 588 KB

english, 2015

20

Analysis of removal mechanism on oxide CMP using mixed abrasive slurry

Lee, Hojun, Jeong, Haedo

Journal:

International Journal of Precision Engineering and Manufacturing

Year:

2015

Language:

english

File:

PDF, 587 KB

english, 2015

21

[ECS 215th ECS Meeting - San Francisco, CA (May 24 - May 29, 2009)] ECS Transactions - Effect of Ceria Abrasives on Planarization Efficiency in STI CMP Process

Park, Boumyoung, Kim, Youngjin, Kim, Hyoungjae, Jeong, Haedo, Dornfeld, David

Year:

2009

Language:

english

File:

PDF, 418 KB

english, 2009

22

The effects of a spray slurry nozzle on copper CMP for reduction in slurry consumption

Lee, Dasol, Lee, Hyunseop, Jeong, Haedo

Journal:

Journal of Mechanical Science and Technology

Year:

2015

Language:

english

File:

PDF, 2.66 MB

english, 2015

23

Changes in the structure properties and CMP manufacturability of a poly-Si film induced by deposition and annealing processes

Park, Sungmin, Jeong, Haedo, Yoon, Sang-Hee

Journal:

Journal of Materials Processing Technology

Year:

2016

Language:

english

File:

PDF, 1.76 MB

english, 2016

24

Mechanical aspects of the chemical mechanical polishing process: A review

Lee, Hyunseop, Lee, Dasol, Jeong, Haedo

Journal:

International Journal of Precision Engineering and Manufacturing

Year:

2016

Language:

english

File:

PDF, 1021 KB

english, 2016

25

Prediction of Real Contact Area from Microtopography on CMP Pad

JEONG, Hobin, LEE, Hyunseop, CHOI, Sungha, LEE, Youngkyun, JEONG, Haedo

Journal:

Journal of Advanced Mechanical Design Systems and Manufacturing

Year:

2012

Language:

english

File:

PDF, 1.83 MB

english, 2012

26

Chemical mechanical planarization of advanced package substrate by controlling selectivity of copper to polymer

Jang, Soocheon, Yuh, Minjong, Lee, Dasol, Jeong, Seonho, Jeong, Haedo

Journal:

Journal of Mechanical Science and Technology

Year:

2018

Language:

english

File:

PDF, 3.76 MB

english, 2018

27

Effect of Relative Surface Charge of Colloidal Silica and Sapphire on Removal Rate in Chemical Mechanical Polishing

Park, Chuljin, Kim, Hyoungjae, Cho, Hanchul, Lee, Taekyung, Kim, Doyeon, Lee, Sangjik, Jeong, Haedo

Journal:

International Journal of Precision Engineering and Manufacturing-Green Technology

Year:

2019

Language:

english

File:

PDF, 1.59 MB

english, 2019

28

Effect of the Lapping Platen Groove Density on the Characteristics of Microabrasive-Based Lapping

Lee, Taekyung, Jeong, Haedo, Lee, Sangjik, Kim, Doyeon, Kim, Hyoungjae

Journal:

Year:

2020

File:

PDF, 8.96 MB

2020

29

Effect of additives for higher removal rate in lithium niobate chemical mechanical planarization

Sukhoon Jeong, Hyunseop Lee, Hanchul Cho, Sangjik Lee, Hyoungjae Kim, Sungryul Kim, Jaehong Park, Haedo Jeong

Journal:

Applied Surface Science

Year:

2010

Language:

english

File:

PDF, 1.13 MB

english, 2010

30

Mathematical modeling of CMP conditioning process

Onemoon Chang, Hyoungjae Kim, Kihyun Park, Boumyoung Park, Heondeok Seo, Haedo Jeong

Journal:

Microelectronic Engineering

Year:

2007

Language:

english

File:

PDF, 704 KB

english, 2007

31

Mechanical effects of polishing pad in copper electrochemical mechanical deposition for planarization

Sukhoon Jeong, Sangjik Lee, Boumyoung Park, Hyoungjae Kim, Sungryul Kim, Haedo Jeong

Journal:

Current Applied Physics

Year:

2010

Language:

english

File:

PDF, 511 KB

english, 2010

32

Application of electrolytic in-process dressing (ELID) grinding and chemical mechanical polishing (CMP) process for emerging hard–brittle materials used in light-emitting diodes

Hyunseop Lee, Hiroshi Kasuga, Hitoshi Ohmori, Hojun Lee, Haedo Jeong

Journal:

Journal of Crystal Growth

Year:

2011

Language:

english

File:

PDF, 2.03 MB

english, 2011

33

Evaluation for micro scale structures fabricated using epoxy-aluminum particle composite and its application

Sungil Chung, Yonggwan Im, Hoyoun Kim, Sunjoon Park, Haedo Jeong

Journal:

Journal of Materials Processing Technology

Year:

2005

Language:

english

File:

PDF, 297 KB

english, 2005

34

Heat and its effects to chemical mechanical polishing

Daehee Kwon, Hyoungjae Kim, Haedo Jeong

Journal:

Journal of Materials Processing Technology

Year:

2006

Language:

english

File:

PDF, 455 KB

english, 2006

35

Correlation between break-in characteristics and pad surface conditions in silicon wafer polishing

Kihyun Park, Jaehong Park, Boumyoung Park, Haedo Jeong

Journal:

Journal of Materials Processing Technology

Year:

2008

Language:

english

File:

PDF, 860 KB

english, 2008

36

Effect of polishing pad with holes in electro-chemical mechanical planarization

Sukhoon Jeong, Sangjik Lee, Haedo Jeong

Journal:

Microelectronic Engineering

Year:

2008

Language:

english

File:

PDF, 1.22 MB

english, 2008

37

Self-conditioning of encapsulated abrasive pad in chemical mechanical polishing

Hoyoun Kim, Hyoungjae Kim, Haedo Jeong, Heondeok Seo, Sangick Lee

Journal:

Journal of Materials Processing Technology

Year:

2003

Language:

english

File:

PDF, 264 KB

english, 2003

38

A study on the fabrication of micro groove on SI wafer using chemical mechanical machining

Junmin Park, Haedo Jeong

Journal:

Journal of Mechanical Science and Technology

Year:

2005

File:

PDF, 331 KB

2005

39

Local/global planarization of polysilicon micropatterns by selectivity controlled CMP

Woonki Shin, Sungmin Park, Hyoungjae Kim, Sukbae Joo, Haedo Jeong

Journal:

International Journal of Precision Engineering and Manufacturing

Year:

2009

Language:

english

File:

PDF, 602 KB

english, 2009

40

A study on the correlation between pad property and material removal rate in CMP

Changsuk Lee, Hojun Lee, Moonki Jeong, Haedo Jeong

Journal:

International Journal of Precision Engineering and Manufacturing

Year:

2011

Language:

english

File:

PDF, 536 KB

english, 2011

41

Correlation between process parameters and electrochemical surface state for electrochemical-mechanical polishing application of copper in acid- and alkali-based electrolyte

Youngkyun Lee, Yong-Jin Seo, Jun-Won Yang, Hyung-Ho Kim, Yeongbong Park, Haedo Jeong

Journal:

Electronic Materials Letters

Year:

2012

Language:

english

File:

PDF, 872 KB

english, 2012

42

Mechanical effect of process condition and abrasive concentration on material removal rate profile in copper chemical mechanical planarization

Hyunseop Lee, Boumyoung Park, Haedo Jeong

Journal:

Journal of Materials Processing Technology

Year:

2009

Language:

english

File:

PDF, 978 KB

english, 2009

43

Mechanical effect of colloidal silica in copper chemical mechanical planarization

Hyunseop Lee, Sukbae Joo, Haedo Jeong

Journal:

Journal of Materials Processing Technology

Year:

2009

Language:

english

File:

PDF, 1.30 MB

english, 2009

44

Evaluation of oxide-chemical mechanical polishing characteristics using ceria-mixed abrasive slurry

Youngkyun Lee, Yong-Jin Seo, Haedo Jeong

Journal:

Electronic Materials Letters

Year:

2012

Language:

english

File:

PDF, 473 KB

english, 2012

45

Planarization of wafer edge profile in chemical mechanical polishing

Yeongbong Park, Hobin Jeong, Sungha Choi, Haedo Jeong

Journal:

International Journal of Precision Engineering and Manufacturing

Year:

2013

Language:

english

File:

PDF, 1.16 MB

english, 2013

46

A hybrid polysilicon planarization for suppressing dishing defects

Sungmin Park, Sang-Hee Yoon, Hyoungjae Kim, Haedo Jeong

Journal:

Journal of Materials Processing Technology

Year:

2012

Language:

english

File:

PDF, 1.07 MB

english, 2012

47

Mathematical model-based evaluation methodology for environmental burden of chemical mechanical planarization process

Lee, Hyunseop, Dornfeld, David Alan, Jeong, Haedo

Journal:

International Journal of Precision Engineering and Manufacturing-Green Technology

Year:

2014

Language:

english

File:

PDF, 404 KB

english, 2014

48

Effect of wafer size on material removal rate and its distribution in chemical mechanical polishing of silicon dioxide film

Lee, Hyunseop, Park, Yeongbong, Lee, Sangjik, Jeong, Haedo

Journal:

Journal of Mechanical Science and Technology

Year:

2013

Language:

english

File:

PDF, 611 KB

english, 2013

49

Effect of contact angle between retaining ring and polishing pad on material removal uniformity in CMP process

Park, Yeongbong, Lee, Hyunseop, Lee, Youngkyun, Park, Sunjoon, Jeong, Haedo

Journal:

International Journal of Precision Engineering and Manufacturing

Year:

2013

Language:

english

File:

PDF, 684 KB

english, 2013

50

Preliminary study on the effect of spray slurry nozzle in CMP for environmental sustainability

Lee, Hyunseop, Park, Yeongbong, Lee, Sangjik, Jeong, Haedo

Journal:

International Journal of Precision Engineering and Manufacturing

Year:

2014

Language:

english

File:

PDF, 813 KB

english, 2014